Hi Craig: I see that you’re still trying to improve your workmanship for soldering wire to a binding posts. Your plan to loop the wire into the binding post hole and then solder is a good one.
A couple things. From what I can see from the picture you show, this soldering job would not pass industry standards (IPC). The wetting angle is not correct and there is no strain relief to the solder joint.
The difficulty, as you know, with soldering anything to a binding post is to get it hot enough. Your choice of solders exacerbates the problem. I would use Sn63/Pb37 alloy which melts at 183C instead of something like SAC 305 which melts at 217C. That way, you don’t have to get the binding post so hot. All electronics prior to 2006 (RoHS) where fabricated with Sn/Pb solder. There is no difference in SQ.
As for technique, you should coat the wire and post with rosin flux prior. Then hold your iron up against the outside of the binding post by the hole the wire is looped thru. Feed your solder to the inside of the binding post at the post/ wire interface. When done, the solder joint should have a smooth fillet (proper wetting) and not be a big blob.
The IPC solder standards are not in the public domain but there are some boot legged copies on the web.
A couple things. From what I can see from the picture you show, this soldering job would not pass industry standards (IPC). The wetting angle is not correct and there is no strain relief to the solder joint.
The difficulty, as you know, with soldering anything to a binding post is to get it hot enough. Your choice of solders exacerbates the problem. I would use Sn63/Pb37 alloy which melts at 183C instead of something like SAC 305 which melts at 217C. That way, you don’t have to get the binding post so hot. All electronics prior to 2006 (RoHS) where fabricated with Sn/Pb solder. There is no difference in SQ.
As for technique, you should coat the wire and post with rosin flux prior. Then hold your iron up against the outside of the binding post by the hole the wire is looped thru. Feed your solder to the inside of the binding post at the post/ wire interface. When done, the solder joint should have a smooth fillet (proper wetting) and not be a big blob.
The IPC solder standards are not in the public domain but there are some boot legged copies on the web.