"The heat sink designer can now factor the shape of the sink as well as the thermal conductivity."
Shape is already included in thermal resistance - length isn't. Extrusions are often specified in degC/W/inch.
The purpose of heat pipes is to remove heat (using liquid inside) from the location where large heatsink won't fit or operate properly (no air flow). Heat pipe connects such hot spot to external heatsink (with some temp. gradient).
Making electronics colder is not necessarily a good thing.
Main problem is to make signal path including output transistors as fast as possible to avoid delays hence TIM.
Heat makes bipolar transistors faster - a good thing (MOS gets slower with temperature - benefits from cooling). It has not much of the effect on reliability as long as junction temp is kept within reason. The only negative effect of heat is life of electrolytic caps shorten by half for each 10 degC increase.
Shape is already included in thermal resistance - length isn't. Extrusions are often specified in degC/W/inch.
The purpose of heat pipes is to remove heat (using liquid inside) from the location where large heatsink won't fit or operate properly (no air flow). Heat pipe connects such hot spot to external heatsink (with some temp. gradient).
Making electronics colder is not necessarily a good thing.
Main problem is to make signal path including output transistors as fast as possible to avoid delays hence TIM.
Heat makes bipolar transistors faster - a good thing (MOS gets slower with temperature - benefits from cooling). It has not much of the effect on reliability as long as junction temp is kept within reason. The only negative effect of heat is life of electrolytic caps shorten by half for each 10 degC increase.

